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Precision Dicing and Grinding

Precision Dicing & Grinding Services

At Optical Filter Source, we specialize in high-precision dicing and grinding services for optical, semiconductor, and microfabrication industries. Our expertise ensures tight tolerances, minimal chipping, and high-yield production, making us a trusted partner for manufacturers requiring precise substrate processing.

Our Precision Dicing & Grinding Capabilities

High-Precision Dicing – Clean, controlled cuts with tight tolerances and low kerf loss
Ultra-Fine Grinding – Achieve precise thickness control and smooth surface finishes
Minimal Chipping & Damage – Optimized techniques to preserve edge integrity
Custom Substrate Processing – Dicing and grinding for glass, crystalline materials, and semiconductor wafers
Scalable Production – From prototyping to high-volume manufacturing

Key Precision Dicing & Grinding Services

High-Speed Dicing – Precision cutting of glass, wafers, and optical substrates
Thin Wafer Grinding – Achieve uniform thickness with sub-micron precision
Edge Grinding & Surface Smoothing – Reducing defects for higher durability and optical performance
Low-Stress Processing – Minimizing mechanical and thermal damage to substrates

Applications of Our Dicing & Grinding Services

Optical Components – Custom-cut filters, lenses, waveguides, and structured optics
Semiconductor Devices – Precision dicing for MEMS, ICs, and photonic devices
Display & Touchscreen Technology – High-quality dicing for thin glass and conductive layers
Biomedical & Sensor Applications – Microfluidic chips, biosensors, and lab-on-chip devices
Aerospace & Defense – High-precision processing for avionics, targeting optics, and sensor arrays

Partner with Optical Filter Source for High-Precision Dicing & Grinding

With strict process controls, we deliver exceptional accuracy, yield, and surface quality for your optical and semiconductor needs.

Contact us today to discuss your precision dicing and grinding requirements, and let us help you achieve unmatched quality and performance.